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Precision ESD IC Chip Trays for Secure Storage of Delicate Semiconductors

Precision ESD IC Chip Trays for Secure Storage of Delicate Semiconductors

Markenbezeichnung: Hiner-pack
Modellnummer: HN24206
MOQ: 500 STÜCK
Preis: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
Zahlungsbedingungen: T/T
Versorgungsfähigkeit: 2000 Stück/Tag
Einzelheiten
Herkunftsort:
China
Zertifizierung:
ROHS, ISO
Tray Weight:
Variiert, typischerweise bis zu 500 Gramm pro Hohlraum
Farbe:
Schwarz
Qualitätssicherung:
Liefergarantie, zuverlässige Qualität
Größe der Umrisslinie:
50,7×50,7×4 mm
Größe des Hohlraums:
3x0,75 mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Formtyp:
Injektion
Wiederverwendbar:
Ja
Form des Trays:
Rechteckig
Saubere Klasse:
Allgemeine und Ultraschallreinigung
Ic-Typ:
BGA,QFP,QFN,LGA,PGA
Verpackungsebene:
Transportpaket
Verzug:
Verzug MAX 0,21 mm
Kapazität:
10x10=100 STK
Verpackung Informationen:
Karton, Palette
Versorgungsmaterial-Fähigkeit:
2000 Stück/Tag
Beschreibung des Produkts
Precision ESD IC Chip Trays for Secure Storage of Delicate Semiconductors

Feature precision-engineered cavities to cradle delicate semiconductors firmly, preventing shifting and electrostatic damage during handling. Maintain stable performance in high-frequency production scenarios, reducing component loss and ensuring consistent operational reliability.


Deliver reliable ESD protection to safeguard sensitive components, maintaining performance in industrial production and storage environments. Resist wear and deformation for long-term use, supporting continuous workflow without interruptions.


Support full customization of cavity size and layout to match diverse IC specifications, aligning with clean production standards for optimal efficiency. Adapt to various automated production lines and packaging requirements, delivering tailored solutions for semiconductor manufacturers.

Key Features/ Benefits 
  • Durable construction
  • Precision cavity layout
  • Durable construction
  • Fully customizable design
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24206
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×4 mm
Cavity Size 3x0.75 mm
Matrix QTY 10x10=100 PCS
Warpage MAX 0.21mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Suitable for semiconductor storage, production line transfer, component testing and packaging. Work seamlessly with automated pick-and-place systems and ESD-controlled environments.

Applied in chip manufacturing plants, advanced packaging facilities and electronic component suppliers. Ideal for long-term inventory storage and inter-plant transportation.
Customized Services
Provide fully tailored solutions for precision ESD IC trays. Modify cavity dimensions, spacing and layout to fit unique semiconductor chip sizes. Utilize high-performance ESD-safe material for enhanced durability. Offer prototype validation and personalized design support to meet specific production needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers