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2 Inch Waffle Pack Chip Trays For High Speed Automated Pick And Place Systems

Markenbezeichnung:	Hiner-pack
Modellnummer:	HN24125
MOQ:	500
Preis:	TBC
Zahlungsbedingungen:	100% Prepayment
Versorgungsfähigkeit:	2000PCS/Day

Einzelheiten

Beschreibung des Produkts

Einzelheiten

Herkunftsort:

SHENZHEN CHINA

Zertifizierung:

ISO 9001 ROHS SGS

Incoterms:

EXW, FOB, CIF, DDU, DDP

Wiederverwendbar:

Formverfahren:

Spritzguss

Eigentum:

ESD

Abmessungen:

50,7 x 50,7 x 4 mm

verwenden:

Transport, Lagerung und Verpackung

Farbe:

Schwarz

Packaging Details:

500 Pcs/carton(According To Actual Packing）

Supply Ability:

2000PCS/Day

Beschreibung des Produkts

Permanent Antistatic Specialized Small Parts Waffle Pack Chip Trays

Constructed from permanently conductive ABS or PC resins, these waffle packs provide a secure path for electrostatic discharge, protecting sensitive gates and circuitry from the moment they are sorted until they are placed. The tray’s thin profile and regular rib pattern create a stable environment that minimizes the gap between the component and the tray cover, effectively preventing thin die from sliding out of their designated pockets during high-acceleration transport within the assembly facility.

Key Features/ Benefits

Anti-Migration Pocket Geometry
Superior Dimensional Stability and Flatness
Permanent ESD Protection (RoHS Compliant)
Interlocking Stackable Architecture
Cleanroom-Ready Purity

Specifications

Brand		Hiner-pack
Model		HN24125
Material		ABS
Tray Type		2-inch Waffle Pack
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7x50.7x5.5mm
Cavity Size		8.22×1.88×0.30mm
Matrix QTY		4X14=56PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

These automation-optimized waffle packs are the preferred choice for High-Volume Semiconductor Assembly and Advanced SMT (Surface Mount Technology) Lines. They are primarily utilized in: Automated Die Sorting, where high-speed flip-chip or wire-bond systems require perfect tray alignment; Precision Kitting for R&D, allowing for the organized and safe movement of diverse component sets through automated test flows; and High-Speed Optoelectronic Packaging, where stable component orientation is vital for lens alignment. Their compact size and standardized footprint also make them ideal for Small Batch Prototyping on production-grade equipment, providing a seamless transition from engineering samples to full-scale manufacturing. Whether you are using manual feeders or advanced robotic handlers, these trays provide the consistency needed for modern micro-manufacturing.

Customization

We provide extensive customization options to ensure the waffle pack fits your specific automated toolset. Our engineering team can add Specialized Chamfers or Tapered Walls to the pockets to further facilitate high-speed tool entry and exit. Customization also includes the addition of Vision Alignment Fiducials or specialized reference marks molded directly into the frame to improve the speed of machine vision recognition. We offer various material grades, from cost-effective Conductive ABS for ambient transport to specialized resins with different colors for lot identification. With a catalog of existing designs, we can often adapt a solution for your unique component geometry in as little as two weeks, ensuring your automated line is supported by a high-precision, customized carrier.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers

Tags:

Behälter JEDEC IC

JEDEC-Matrix-Behälter

IC Chip Tray

Kundenspezifische JEDEC-Behälter

Waffel-Satz Chip Trays

Elektronische Bauelement-Behälter

Bloß sterben Behälter

Statische Antibehälter

Waffel-Satz-Deckel-Clip

Gel-klebriger Kasten

Oblaten-Verschiffen-Kasten

Metallwafer-Kassette

Behälter JEDEC IC

JEDEC-Matrix-Behälter

IC Chip Tray

Kundenspezifische JEDEC-Behälter

Waffel-Satz Chip Trays

Elektronische Bauelement-Behälter

Bloß sterben Behälter

Statische Antibehälter

Waffel-Satz-Deckel-Clip

Gel-klebriger Kasten

Oblaten-Verschiffen-Kasten

Metallwafer-Kassette

2 Inch Waffle Pack Chip Trays For High Speed Automated Pick And Place Systems

2 Inch Waffle Pack Chip Trays For High Speed Automated Pick And Place Systems

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