logo
produits
Haus / Produits / Waffel-Satz Chip Trays /

4-inch Waffle Pack Tray – ESD Safe IC Handling for Automated Lines

4-inch Waffle Pack Tray – ESD Safe IC Handling for Automated Lines

Markenbezeichnung: Hiner-pack
Modellnummer: HN25118
MOQ: 500 Stück
Preis: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Zahlungsbedingungen: 100% Vorauszahlung
Versorgungsfähigkeit: 2000 Stück/Tag
Einzelheiten
Herkunftsort:
China
Zertifizierung:
RoHS、ISO
Matrix:
10×17=170 STÜCK
Feuchtigkeitsbeständigkeit:
Bis zu 90%
Größe des Hohlraums:
6,35 x 3,0 x 1,2 mm
Gewichtskapazität:
Variiert, typischerweise bis zu 500 Gramm pro Hohlraum
UV-Beständigkeit:
Ja
Verzug:
Weniger als 0,76 mm
Wiederverwendbarkeit:
Wiederverwendbar
Anwendung:
Handhabung, Lagerung und Versand von ICs
Verpackung Informationen:
70~100 Stück/karton (nach Kundenwunsch)
Versorgungsmaterial-Fähigkeit:
2000 Stück/Tag
Beschreibung des Produkts
4-inch Waffle Pack Tray – ESD Safe IC Handling for Automated Lines
This 4-inch waffle pack tray provides secure, electrostatic discharge-protected handling for integrated circuits. Its rigid structure ensures consistency for automated pick-and-place systems and conveyor lines. With a standard 4-inch footprint, the tray is ideal for high-volume manufacturing and logistics.
Key Features/ Benefits
  • ESD safe material reduces static risk
  • Compatible with automated handling systems
  • Standard 4-inch waffle matrix layout 
  • Stackable and reusable
  • Precision pocket geometry  
Specifications
Brand Hiner-pack
Model HN25118
Material ESD-safe thermoplastic PC
Tray Type 4-inch waffle pack
Color Black
Surface Resistivity 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 101.6x101.6x5.1 mm
Pocket Size 6.35x3.0x1.2mm
Matrix QTY 10×17=170PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Certifications RoHS, ISO
Applications
  • Automated assembly lines
  • IC staging & handling
  • Semiconductor storage

Customization:

The tray’s flexible design supports a wide range of customized configurations to meet specific production challenges: 

•  Tailored Pocket Layouts: Adjust pocket size, count, or spacing to match non-standard part dimensions or shapes.  

•  Color Coding Options: Use ESD-safe materials in selected colors for identifying product types, workstations, or production phases.  

•  In-Mold Marking: Add customer-specific identifiers or tracking features during manufacturing for clear and permanent identification.  

•  Specialized Alignment Features: Modify edges or add tool-specific indexing tabs to optimize performance in proprietary handling systems.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Factory-direct manufacturer of JEDEC & IC trays
  • JEDEC compliant, automation-compatible designs
  • OEM & ODM customization supported
  • Consistent quality and stable supply
  • Trusted by global semiconductor customers