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High Temperature 150°c Heat Resistant 9*10 JEDEC Tray Designed for Semiconductor transportation

High Temperature 150°c Heat Resistant 9*10 JEDEC Tray Designed for Semiconductor transportation

Markenbezeichnung: Hiner-pack
Modellnummer: JEDEC TRAY SERIES
MOQ: 500 PCS
Preis: OTM
Zahlungsbedingungen: 100% Prepayment
Versorgungsfähigkeit: 2000-3000PCS/Day
Einzelheiten
Herkunftsort:
Shenzhen, China
Zertifizierung:
ISO9001, SGS, ROHS
Verpackungstyp:
Tablett
Form des Trays:
Rechteckig
Customized Service:
Standard- und Nichtstandardunterstützung
Schimmel NO:
HN24106
Abmessungen:
Variiert je nach IC -Größe
Ebenheit:
weniger als 0.76mm
Verpackung Informationen:
Transportverpackung
Supply Ability:
2000-3000PCS/Day
Hervorheben:

150°C heat resistant JEDEC tray

,

semiconductor transport IC tray

,

high temperature JEDEC IC tray

Beschreibung des Produkts

Product Description:

    Our JEDEC IC Trays are high-quality trays designed specifically for the efficient and safe storage of electronic components ICs. With a heat resistance of up to 150°C, these trays are ideal for handling components that require high-temperature processing or storage.The packaging type of these trays is specifically designed as a tray, which provides a secure and organized way to store and transport electronic ICs. This tray packaging ensures that the components are protected from damage during handling and shipping, making it an essential tool for electronic component manufacturers and distributors.One of the key features of the JEDEC IC Trays is their reusability. These trays are durable and long-lasting, allowing them to be used multiple times without compromising their performance or integrity. This not only makes them a cost-effective solution for storage and transportation needs but also a sustainable choice for companies looking to reduce their environmental impact.


Technical Parameters:

Flatness Less Than 0.76mm
Tray Shape Rectangular
Reusable Yes
Customized Service Support Standard And Non-Standard
Color Black
IC Type BGA, QFP, QFN, LGA, PGA
Dimensions Varies Depending On IC Size
Size 322.6*135.9*12.19mm
Heat Resistant High Temperature 150°C

Applications:

I. SMT Process Automation Management

Used for automated component handling in SMT assembly processes, enabling efficient and accurate counting and material management through barcode scanning for model, brand, and batch information.


II. Semiconductor Packaging and Testing

Serves as a standard storage and transportation device for chip packaging and testing, ensuring consistent product quantity and quality stability.

Used for temporary storage and transportation of chips after wafer dicing, preventing electrostatic damage and physical collisions.


Packing and Shipping:

Product Packaging and Shipping for JEDEC IC Trays:

Our JEDEC IC Trays are carefully packaged to ensure safe delivery to our customers. Each tray is securely placed in a protective box to prevent any damage during transportation. Additionally, the trays are labeled with product information for easy identification.


For shipping, we use reliable courier services to deliver the trays to your desired location. Our packaging is designed to withstand the rigors of shipping and handling, ensuring that your JEDEC IC Trays arrive in perfect condition.