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180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

Markenbezeichnung: Hiner-pack
Modellnummer: HN24220
MOQ: 500 STÜCK
Preis: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Zahlungsbedingungen: T/T
Versorgungsfähigkeit: 2000 Stück/Tag
Einzelheiten
Herkunftsort:
China
Zertifizierung:
ROHS, ISO
Tray Weight:
Variiert, typischerweise bis zu 500 Gramm pro Hohlraum
Farbe:
Normalerweise schwarz oder dunkelgrau zum ESD-Schutz
Qualitätssicherung:
Liefergarantie, zuverlässige Qualität
Größe des Hohlraums:
4x5x1,6 mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Schimmelpilztyp:
Injektion
Wiederverwendbar:
Ja
Form des Trays:
Rechteckig
Saubere Klasse:
Allgemeine und Ultraschallreinigung
Ic-Typ:
BGA,QFP,QFN,LGA,PGA
Verpackungsebene:
Transportpaket
Ebenheit:
Weniger als 0,76 mm
Kapazität:
13x28=364 STK
Verpackung Informationen:
Karton, Palette
Versorgungsmaterial-Fähigkeit:
2000 Stück/Tag
Hervorheben:

180°C high temp JEDEC tray

,

ESD protection JEDEC IC tray

,

semiconductor packaging JEDEC tray

Beschreibung des Produkts
High Temp ESD JEDEC Tray for AI Chips Packaging
This JEDEC tray is specially designed for high temperature semiconductor processes, such as baking, burn-in, and AI chip packaging.
It ensures dimensional stability and precise positioning during automated handling.
Key Features/ Benefits 
  • Up to 180°C high temperature resistant (PEI material)
  • Stable ESD protection (1E4–1E11 Ω)
  • Compatible with ASM / Advantest / YAMAHA machines
  • Free design within 24 hours
  • JEDEC standard footprint
Specifications
Brand Hiner-pack
Model  HN24220
Material  MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 4x5x1.6 mm
Matrix QTY 13x28=364 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.
  • AI chips / GPU / ASIC
  • BGA / QFN / IC packaging
  • Burn-in & baking process
  • Production line buffering
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • 10+ years semiconductor packaging experience
  • In-house mold design capability
  • OEM & ODM customization supported
  • Consistent quality and stable supply
  • Daily capacity: 2000+ pcs